Archive for the 'Coherent DSP' Category
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November 05, 2026
³Ô¹ÏºÚÁÏ Earns LEAP Award for 1.6T Optical DSP Platform Portfolio
By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ
Design World recently announced their . The ³Ô¹ÏºÚÁÏ? 1.6T optical DSP platform portfolio has been honored in the connectivity category.
³Ô¹ÏºÚÁÏ has decades of expertise in optical DSPs and ushered in the 1.6T era. The portfolio being honored was announced earlier this year and spans Ara T, Ara X, Aquila M and Petra.
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September 29, 2026
³Ô¹ÏºÚÁÏ Wins EDGE Award for COLORZ 1600 2nm 1.6T ZR/ZR+ Pluggable Optical Platform
By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ
In the , the ³Ô¹ÏºÚÁÏ? COLORZ? 1600 2nm 1.6T ZR/ZR+ pluggable optical platform won the Machine Vision and Optical Components & Systems category.
Electronic Design presented this year¡¯s winners and honorees to celebrate recent design and engineering feats that excel in the industry. These innovations are pushing the bounds and represent the leading ¡°EDGE¡± of technology.
³Ô¹ÏºÚÁÏ COLORZ 1600 is the industry¡¯s first 1.6T ZR/ZR+ data center interconnect (DCI) pluggable. Powered by ³Ô¹ÏºÚÁÏ Electra, the industry¡¯s first 2nm 1.6T ZR/ZR+ coherent DSP, the device delivers efficient, high-performance and secure optical transmission for hyperscale AI and cloud networks globally. The pluggable is purpose-built for long-distance links; COLORZ 1600 connects campus (20km), metro (120km) and regional (1,000km) data centers at 1.6T.
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July 08, 2026
Scaling AI Networks with Intelligent Ethernet: Validating Packet Trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET) on ³Ô¹ÏºÚÁÏ Teralynx
By Vikram Dattatri, Senior Engineer, Cloud Platform Group, ³Ô¹ÏºÚÁÏ
Packet trimming doesn¡¯t prevent traffic losses from occurring; instead, it streamlines the process for recovering them. It is also one of many technologies ³Ô¹ÏºÚÁÏ is developing to optimize networks for the AI era.
Artificial intelligence infrastructure is driving a fundamental shift in how data center networks are designed, validated, and deployed. As clusters scale to thousands¡ªor even tens of thousands¡ªof GPUs, the network is no longer just a connectivity layer. It becomes a tightly coupled component of the compute system, directly impacting job completion time, efficiency and overall cost.
To address these evolving requirements, Ethernet is undergoing a transformation. At OFC 2026, ³Ô¹ÏºÚÁÏ and Keysight Technologies demonstrated (see the video below) how next-generation Ethernet fabrics can meet the demands of AI workloads through a combination of advanced features and realistic validation. Leveraging Keysight¡¯s and , the collaboration showcased how the?³Ô¹ÏºÚÁÏ? Teralynx? switch fabric?supports emerging Ultra Ethernet Consortium (UEC) capabilities, with a particular focus on packet trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET).
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June 17, 2026
Plasmonics: A Path to Higher Bandwidth in Optics in the AI Era
By Claudia Hoessbacher, Senior Director, and Wolfgang Heni, Director, Optical Engineering, ³Ô¹ÏºÚÁÏ
Plasmons have been used to accelerate drug discovery, enhance the sensitivity of sensors and even .
Ongoing research at ³Ô¹ÏºÚÁÏ seeks to harness them to improve the performance of optical networks for the AI era. Plasmonics, a technology that leverages the properties of surface plasmon polaritons (SPPs), provides a promising pathway for enhancing the roadmap of silicon photonic (SiPho) light engines, a critical component inside optical modules.
Plasmonic-based SiPho light engines could support modules operating at 3.2T and beyond while consuming a fraction of the space and power per bit of modules based on existing technologies. Manufacturers could leverage foundry process technologies for scaling production.
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May 28, 2026
Open CPX Sets the Stage for More Flexible, Scalable Connectivity
By George Hervey, Associate Vice President, Cloud Switch Marketing, ³Ô¹ÏºÚÁÏ
Co-packaged connectivity is coming. The (Co-packaging Multisource Agreement) is working to simplify adoption.
The consortium, which includes ³Ô¹ÏºÚÁÏ and other leaders in connectivity, is developing specifications and standards for solutions for integrating near-packaged optical (NPO) and/or co-packaged optical (CPO) technology into switches and servers in scalable, repeatable ways. Members are also working to support interoperability with co-packaged copper (CPC).
The idea is to give data center service providers, equipment manufacturers and others a unified framework for next-generation connectivity to accelerate innovation and meet the surging demand for these technologies. Fewer than one million near- and co-packaged ports shipped in 2025, according to LightCounting; by 2030, shipments are projected to surpass 100 million ports per year.1 Standards that can ensure predictability and flexibility will be critical in enabling this expected growth.
¡°The initial target of the MSA will be to develop an optimized optical engine with a defined pluggable socket and electrical connector system supporting high speed and high-density connectivity between a switch or processor and co-packaged and near-package interconnects,¡± the Open CPX MSA website states. ¡°The specifications will define connector mechanicals, thermals, electrical pinout, mechanical form factors, electrical, optical, and management interface specifications to ensure interoperability between multiple vendors of Open CPX.¡±
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