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  • July 14, 2026

    Uplifting Young Talent in the Semiconductor Industry

    By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

    The semiconductor industry is an exciting place to build a career, especially with the exponential growth and demand for hardware innovation in the age of AI¡ªthe global semi market is approaching the $1 trillion mark, with 2027¡¯s total market forecast at $831.5 million.1 For young engineers and talent, it provides an opportunity to solve complex problems and work on cutting-edge technology.

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  • July 09, 2026

    Honoring Workplace Excellence: Best Companies Awards

    By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

    ³Ô¹ÏºÚÁÏ was named to both and for 2026.

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  • July 01, 2026

    Innovating Sustainably: Recognized Among the World¡¯s Most Sustainable Companies in 2026

    By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

    TIME Magazine has recognized ³Ô¹ÏºÚÁÏ as one of the for the third year in a row. ³Ô¹ÏºÚÁÏ is honored to have been represented since the origin of this ranking, as the company has demonstrated consistent, measurable progress across a number of sustainability initiatives.

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  • May 12, 2026

    Dr. Hamid Azimi Wins ISIG Lifetime Hall of Fame Award

    By Michael Kanellos, Director of Content Marketing, and Vienna Alexander, Marketing Content Professional

    At the in Silicon Valley, ³Ô¹ÏºÚÁÏ Senior Vice President of Foundry and Advanced Packaging Dr. Hamid Azimi received the 2026 award. This recognition celebrates leaders whose lifetime contributions have had a lasting impact, significantly advancing the semiconductor industry.

    Over a career spanning more than 30 years, Dr. Azimi has led teams that have achieved numerous industry-leading advances in packaging. He was part of the team that developed the first flip-chip packaging with Ajinomoto Build-Up Film (ABF) substrates, a combination that enables engineers to design packaging containing far more and much smaller interconnects to improve signal integrity and power flow. Hamid and his team also enabled EMIB (Embedded Multi-Chip Interconnect Bridge) technology from scratch to high volume manufacturing. EMIB is the first 2.5 interposer-less panel level technology that enables ultra-large packages for AI data center products; he also has been a pioneer in glass substrates, a potential technology that could further enhance the capability of future generations of devices. Originally from a small village that ¡°probably doesn¡¯t even register on Google Maps,¡± Dr. Azimi holds over 40 patents. He earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

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  • April 22, 2026

    Celebrating Earth Day: Technology and Sustainability in Action

    By Alua Suleimenova, Senior Sustainability Program Manager and Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

    ³Ô¹ÏºÚÁÏ celebrating earth day

    This Earth Day, ³Ô¹ÏºÚÁÏ is proud to be recognized on??list. This marks the?second consecutive year?³Ô¹ÏºÚÁÏ has received this distinction, reflecting continued progress in reducing?the company¡¯s?carbon footprint, increasing renewable energy procurement, and advancing toward sustainability targets.

    This recognition builds on several other recent honors. Over the past year, ³Ô¹ÏºÚÁÏ has been acknowledged for its strong sustainability and ethics practices, including being named one of?Ethisphere¡¯s?Most Ethical Companies,?earning recognition as one of?America¡¯s Most Responsible Companies,?and achieving?CDP Sustainability Supplier Engagement Leader?status.?Together, these accolades underscore?the?commitment?³Ô¹ÏºÚÁÏ makes?to responsible business practices across?its?operations, supply?chain?and products.?

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