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Accelerated Infrastructure for the AI Era

Data Infrastructure for the AI Era
Accelerated infrastructure for connectivity and custom compute

³Ô¹ÏºÚÁÏ Enables AI Infrastructure


To realize the promise of AI, hyperscalers are undertaking one of the largest infrastructure buildouts in history¡ªand they rely on ³Ô¹ÏºÚÁÏ as a critical AI infrastructure partner. ³Ô¹ÏºÚÁÏ designs custom silicon tailored for any application and offers the industry¡¯s most comprehensive portfolio of interconnects and network switch products. From custom compute to rack, row, data center, campus and multi-campus connectivity, ³Ô¹ÏºÚÁÏ enables the world¡¯s most advanced AI infrastructure.

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Investor Event


At this custom AI investor event, the ³Ô¹ÏºÚÁÏ leadership team shares its perspective on the rapidly evolving AI market and technology landscape, with a particular focus on custom silicon and custom cloud solutions for hyperscalers.

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NVIDIA and ³Ô¹ÏºÚÁÏ: Powering Accelerated Computing

NVIDIA and ³Ô¹ÏºÚÁÏ: Powering Accelerated Computing


Accelerated computing requires tremendous bandwidth. NVIDIA is working with ³Ô¹ÏºÚÁÏ to deliver it. Achyut Shah, SVP & GM, Connectivity Business Unit at ³Ô¹ÏºÚÁÏ, describes the history of the collaboration.

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The Rise of Customized AI Factories


³Ô¹ÏºÚÁÏ President and COO Chris Koopmans joins Daniel Newman at the SixFive Summit to explore the rapidly evolving AI market landscape, including emerging hyperscalers and sovereign AI. Chris discusses the rise of custom silicon and the role ³Ô¹ÏºÚÁÏ plays in powering the next generation of AI factories.

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The Rise of Customized AI Factories
Custom HBM Compute Architecture

³Ô¹ÏºÚÁÏ Custom HBM Compute Architecture

³Ô¹ÏºÚÁÏ has developed a new custom HBM compute architecture that optimizes custom XPU performance and TCO. In collaboration with industry leaders like Micron, Samsung and SK Hynix, ³Ô¹ÏºÚÁÏ is setting new benchmarks for AI accelerators.

Connectivity for the Million XPU Era


Xi Wang, ³Ô¹ÏºÚÁÏ SVP & GM, Connectivity BU joins Will Townsend from SixFive Media to explore the role of high-bandwidth connectivity in the rapid evolution of AI infrastructure and data centers. Xi discusses the innovations and challenges that are unfolding at every level, from the XPU and rack to the data center to multi-site AI clusters.

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Connectivity for the Million XPU Era

³Ô¹ÏºÚÁÏ optical DSPs: Powering the future of AI infrastructure


AI and cloud computing are pushing network demands to unprecedented levels, requiring optical DSPs to deliver ultra-high bandwidth, low latency, and energy efficiency. ³Ô¹ÏºÚÁÏ is leading this transformation with advanced PAM4 and coherent DSP solutions that power AI fabrics, data center interconnects, and telecom networks¡ªdriving the future of high-performance connectivity.

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The Evolution of AI Interconnects


The rapid expansion in the size and capacity of AI workloads is significantly impacting both computing and network technologies in the modern data center.?

The desire for larger clusters with shorter compute times has driven heightened focus on networking interconnects, with designers embracing state-of-the-art technologies to ensure efficient data movement and communication between the components comprising the AI cloud.

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³Ô¹ÏºÚÁÏ Launches Next-generation CXL Switch, Enabling Memory Pooling to Break Through the AI ¡°Memory Wall¡±

³Ô¹ÏºÚÁÏ Launches Next-generation CXL Switch, Enabling Memory Pooling to Break Through the AI ¡°Memory Wall¡±

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³Ô¹ÏºÚÁÏ at OFC 2025

³Ô¹ÏºÚÁÏ Launches Industry¡¯s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure

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Custom Compute in the AI Era

Inside ³Ô¹ÏºÚÁÏ¡¯s Expanding Custom Silicon Opportunity

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