³Ô¹ÏºÚÁÏ

Archive for the 'Company News' Category

• May 12, 2026

  

  

  

  Dr. Hamid Azimi Wins ISIG Lifetime Hall of Fame Award

  By Michael Kanellos, Director of Content Marketing, and Vienna Alexander, Marketing Content Professional

  

  At the in Silicon Valley, ³Ô¹ÏºÚÁÏ Senior Vice President of Foundry and Advanced Packaging Dr. Hamid Azimi received the 2026 award. This recognition celebrates leaders whose lifetime contributions have had a lasting impact, significantly advancing the semiconductor industry.

  Over a career spanning more than 30 years, Dr. Azimi has led teams that have achieved numerous industry-leading advances in packaging. He was part of the team that developed the first flip-chip packaging with Ajinomoto Build-Up Film (ABF) substrates, a combination that enables engineers to design packaging containing far more and much smaller interconnects to improve signal integrity and power flow. Hamid and his team also enabled EMIB (Embedded Multi-Chip Interconnect Bridge) technology from scratch to high volume manufacturing. EMIB is the first 2.5 interposer-less panel level technology that enables ultra-large packages for AI data center products; he also has been a pioneer in glass substrates, a potential technology that could further enhance the capability of future generations of devices. Originally from a small village that ¡°probably doesn¡¯t even register on Google Maps,¡± Dr. Azimi holds over 40 patents. He earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

  Read More
• April 22, 2026

  

  

  

  Celebrating Earth Day: Technology and Sustainability in Action

  By Alua Suleimenova, Senior Sustainability Program Manager and Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  This Earth Day, ³Ô¹ÏºÚÁÏ is proud to be recognized on??list. This marks the?second consecutive year?³Ô¹ÏºÚÁÏ has received this distinction, reflecting continued progress in reducing?the company¡¯s?carbon footprint, increasing renewable energy procurement, and advancing toward sustainability targets.

  This recognition builds on several other recent honors. Over the past year, ³Ô¹ÏºÚÁÏ has been acknowledged for its strong sustainability and ethics practices, including being named one of?Ethisphere¡¯s?Most Ethical Companies,?earning recognition as one of?America¡¯s Most Responsible Companies,?and achieving?CDP Sustainability Supplier Engagement Leader?status.?Together, these accolades underscore?the?commitment?³Ô¹ÏºÚÁÏ makes?to responsible business practices across?its?operations, supply?chain?and products.?

  Read More
• April 16, 2026

  

  

  

  HCDS Best Paper Award Winner: Bridging the Memory Hierarchy Gap with Photonic Fabric? Technology

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  At the , co-located with Architectural Support for Programming Languages and Operating Systems (ASPLOS), Senior Staff Engineer Jing Ding won Best Paper for her research on the ³Ô¹ÏºÚÁÏ? Photonic Fabric? Technology Platform.

  There is a critical mismatch between the capacity and bandwidth available across memory tiers and the demands of large-scale LLM inference, revealed through characterizing KV cache retrieval efficiency. In fact, across LLaMA3-8B to 405B on NVIDIA A100/H200 systems, retrieving KV cache from host memory achieves up to 100x speedup over GPU re-computation for contexts up to 4M tokens, but host DRAM capacity cannot accommodate the KV demands of long-context, multi-tenant and multi-turn workloads.

  While CXL-enabled memory pooling could be applied in this capacity, it faces fundamental electrical interconnect limitations, namely rack-scale distance constraints, switch contention under multi-host workloads, and power-thermal scaling challenges. By leveraging the Photonic Fabric??optical interconnect technology platform to break reach limitations, along with CXL as a host communication protocol, ³Ô¹ÏºÚÁÏ enables a unique pod-scale memory sharing appliance that can enable up to 16 servers across multiple racks to dynamically share up to 32 TB of memory capacity.

  Read More
• March 17, 2026

  

  

  

  ³Ô¹ÏºÚÁÏ Honored for 1.6T Silicon Photonics Light Engine and ACC Linear Equalizers in Lightwave Innovation Reviews 2026

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  In the , ³Ô¹ÏºÚÁÏ received awards for two of its optical connectivity products: the active copper cable (ACC) linear equalizers and 1.6T silicon photonics light engine. Both products received a 4.0 outstanding honoree status on the 5.0 scale, which is defined as an excellent product with technical features and performance that provide clear, substantial benefits.

  An esteemed panel of independent judges evaluated optical communications and broadband designs to showcase the most innovative products, technologies, and programs that have a significant impact on the semiconductor industry.

  Read More
• March 11, 2026

  

  

  

  ³Ô¹ÏºÚÁÏ Recognized as a Leading Charitable Company

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  The first-ever edition of the , presented by Newsweek and Statista, commends ³Ô¹ÏºÚÁÏ as one of the nation¡¯s leaders in community impact.

  The new ranking selected the top 300 companies that fared best in surveys of over 18,000 U.S. respondents, along with KPI philanthropy metrics, social listening, and other thorough research. ³Ô¹ÏºÚÁÏ has been awarded other distinctions in Newsweek and Statista collaborations, which, in combination with this new humanitarian ranking, further position ³Ô¹ÏºÚÁÏ as a trustworthy company.

  Read More

Recent Posts

• Open CPX Sets the Stage for More Flexible, Scalable Connectivity
• 224G Long-Range SerDes for Scale-up and Scale-inside
• PCIe-based Switching for AI Scale-up Networks
• Why Scale-up AI Networks Demand Scalable Optical Test
• Solving AI¡¯s Three Big Problems Through Photonic Fabric? Technology