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Archive for the 'Company News' Category

• September 16, 2026

  

  

  

  ³Ô¹ÏºÚÁÏ Montage: Stories of Recharging and Finding Meaning

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  Doing your best work requires a little balance. Every quarter at ³Ô¹ÏºÚÁÏ, employees around the globe have the opportunity to partake in a Recharge Weekend, two extra paid days off, to relax how they see fit. While enjoying their time off, many employees found a deeper connection to their meaningful work at ³Ô¹ÏºÚÁÏ.

  

  For Senior Staff Test Engineer Yaswanth Chalamalasetti, the benefit provided an opportunity to connect with nature, with the waterfall serving as a metaphor for his work on the test floor.

  ¡°Got a break from testing chips thanks to ³Ô¹ÏºÚÁÏ's amazing Recharge Weekend benefit, but I was still ¡®testing the waters¡¯ by hiking to beautiful?Tumpak?Sewu,¡± says Chalamalasetti. ¡°The name means ¡®a thousand waterfalls,¡¯ and it's a great reminder that success (and a good bin¡ªaka a working chip shipped to a customer) comes from a thousand small steps rather than one giant leap. And just like the water flowing here, ideas never stop, and?neither?does ³Ô¹ÏºÚÁÏ.¡±

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• September 01, 2026

  

  

  

  Program Spotlight: ³Ô¹ÏºÚÁÏ New Graduates Accelerate Professional/Technical Skills and Build Community

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  Entering the workforce as a new graduate is a big milestone. ³Ô¹ÏºÚÁÏ aims to set up new grads for success through supportive programming designed to fast-track early career growth and foster community among cohorts.

  Approximately 200 new graduate hires across the United States, Canada, and India recently completed the inaugural New Graduate Accelerator Program at ³Ô¹ÏºÚÁÏ. Through technical learning, professional development and community-building experiences¡ªincluding connections with senior leaders and engineers across the company¡ªnew grads built the technical expertise, skills and relationships needed to navigate the first year at ³Ô¹ÏºÚÁÏ. Along the way, we also gained a deeper understanding of the company¡¯s business, technology and culture.

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• August 20, 2026

  

  

  

  Shedding Light on AI's Blindspot

  By Uniquely Wired, Profile of Angelina Totovi?, Principal Engineer, Photonic Fabric Business Unit, ³Ô¹ÏºÚÁÏ

  

  This article was originally published in .

  The frontier of photonics is among the least predictable corners of modern engineering, a place where quiet research can grow into $5.5 billion dollar acquisitions inside a five-year window, and where the engineers closest to the science are often so invested in the technological developments that they are the last to learn how much value they have actually created. Angelina has been inside that turbulence from the start. The deal ³Ô¹ÏºÚÁÏ struck with Celestial AI in late 2025, the largest event in her professional life so far, arrived through her newsfeed the same way it arrived for everyone else. The role she holds today did not exist when she first sat down to work on the technology that produced it. Read across the whole arc, her career has been one long exercise in learning to work with things she could not predict.

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• August 12, 2026

  

  

  

  The Road Back to ³Ô¹ÏºÚÁÏ: Finding Impact and Scale in AI Networking

  By Moshe Hershkovitz, Embedded Staff Software Engineer, ³Ô¹ÏºÚÁÏ

  

  There¡¯s a saying in Hebrew that every ending is the first chapter of a new beginning. When it comes to my ³Ô¹ÏºÚÁÏ story, the new beginning had the same starting point.

  I graduated university with a degree in computer engineering and joined ³Ô¹ÏºÚÁÏ as a Storage Security Firmware Engineer, working within a group focused on building security infrastructure from the ground up. It was a fascinating experience where I learned an immense amount about code, lab environments and firmware development. It was my ideal work environment: high energy, constantly challenging and had a meaningful impact.

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• August 05, 2026

  

  

  

  ³Ô¹ÏºÚÁÏ? Photonic Fabric? Wins AI Infrastructure Award at FMS 2026

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  At the Future of Memory and Storage (FMS) trade show, ³Ô¹ÏºÚÁÏ won the AI Infrastructure award for its Photonic Fabric? technology, a transformational optical interconnect platform that overcomes the bandwidth and memory bottlenecks limiting AI infrastructure. By replacing electrical interconnects with optical I/O across package-, server- and rack-scale architectures, ³Ô¹ÏºÚÁÏ? Photonic Fabric? enables scalable AI systems with dramatically higher bandwidth, lower latency, reduced power consumption and unprecedented memory scalability.

  Memory bandwidth, memory locality and data movement are pressing constraints on AI training and inference scalability and token efficiency. Traditional architectures were not designed to support hundreds or thousands of accelerators across multiple racks. Photonic Fabric technology facilitates a new generation of disaggregated memory architectures where memory capacity is no longer constrained by the physical boundaries of individual servers or packages.

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