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³Ô¹ÏºÚÁÏ Ushers In the 1.6T Era with Expanded Optical DSP Platform Portfolio, Redefining AI Data Center End-to-End Connectivity

Multi-generational, Industry-leading DSPs, Advanced SerDes and Industry¡¯s Broadest End-to-End Connectivity Portfolio Position ³Ô¹ÏºÚÁÏ as the Driving Force in Next-gen AI Infrastructures

SANTA CLARA, Calif. ¨C March 12, 2026?¨C??(NASDAQ: MRVL),?a leader in data infrastructure semiconductor solutions, today announced a major expansion of its 1.6T optical DSP platform portfolio, advancing the industry¡¯s transition from 800G into 1.6T next-generation AI data center connectivity.

³Ô¹ÏºÚÁÏ has a multi-generational history of industry firsts. The company was the first to introduce 200G/lane 1.6T DSPs in 5nm with ³Ô¹ÏºÚÁÏ? Nova in 2023, followed by the 3nm 1.6T Ara platform in 2024, which increased performance and reduced the power envelope as the demand for 1.6T modules expanded in 2025. Now shipping in mass volume to global customers, Ara is enabling the world¡¯s hyperscalers and cloud providers to deploy 1.6T pluggable connectivity for AI data centers.

Today, ³Ô¹ÏºÚÁÏ is introducing the next wave of its 3nm 1.6T optical DSP platform portfolio, increasing performance per watt by optimizing separately for each high-volume use case and introducing new capabilities, including:

• Ara T, the first 8x200G transmit-retimed optics (TRO) DSP, delivers improved power efficiency and reduced total cost of ownership in network deployments.
• Ara X, the first 1.6T DSP with advanced link reliability capabilities, enables customers to achieve higher resilience for optical networks.
• Petra, the first 3nm 8x100G to 4x200G gearbox, enables high power efficiency and unlocks new, more flexible infrastructure designs.
• Aquila M, the first O-band-optimized, coherent-lite optical DSP with integrated media access control security (MACsec), adds critical built-in security to next-generation optical links.

As AI infrastructure scales exponentially, connectivity has become the primary bottleneck of the modern data center, and the solution requires more than a ¡°one-size-fits-all¡± approach. New, dedicated semiconductor interconnect solutions are required to address the increasing performance, power, design, security and application-specific challenges. With these new 1.6T offerings and an unmatched breadth and depth of expertise¡ªand offering a full connectivity stack including industry-first DSPs, advanced SerDes, switching, interconnects, drivers and TIAs, and the ³Ô¹ÏºÚÁÏ? RELIANT? interconnect telemetry platform¡ª³Ô¹ÏºÚÁÏ is uniquely positioned to address this demand.

¡°³Ô¹ÏºÚÁÏ pioneered PAM DSP technology, and we continue to lead with advanced SerDes and production-proven 800G platforms. We are now extending that multi-generational product leadership into the 1.6T era,¡± said Xi Wang, senior vice president and general manager, Connectivity Business Unit at ³Ô¹ÏºÚÁÏ. ¡°With these new products, ³Ô¹ÏºÚÁÏ will deliver the performance, power efficiency and manufacturing capacity required to keep up with the explosive growth of next-generation AI data centers.¡±

¡°The performance of today¡¯s data centers¡ªpowered by hundreds of thousands of GPUs, XPUs and other advanced compute engines¡ªdepends on the interconnect technologies that link them together,¡± said Vladimir Kozlov, founder and CEO at LightCounting. ¡°³Ô¹ÏºÚÁÏ DSP products are essential to many high-speed links in modern data center infrastructure, enabling compute resources to operate at peak performance and efficiency. The company¡¯s expanded 1.6T DSP portfolio ensures that data centers can fully maximize their compute investments well into the future.¡±

Broadest End-to-End Connectivity Portfolio

³Ô¹ÏºÚÁÏ delivers the industry¡¯s most comprehensive portfolio of connectivity platform solutions for scale-up, scale-out and scale-across AI infrastructure, with a vast global installed base across hyperscale and cloud deployments and millions of high-speed lanes deployed worldwide.

The ³Ô¹ÏºÚÁÏ portfolio spans the full data center connectivity stack, including DSPs, SerDes, switching, interconnects, drivers and TIAs to support all systems, devices, links and nodes across the network. The new offerings announced today extend the company¡¯s existing 1.6T portfolio, which includes ³Ô¹ÏºÚÁÏ Ara, Alaska? and Nova DSPs, its Ethernet PHY platform, the Silicon Photonics Light Engine and the LPO TIA and laser driver chipset.

³Ô¹ÏºÚÁÏ also provides supporting system-level technologies such as the ³Ô¹ÏºÚÁÏ RELIANT interconnect telemetry platform, which helps customers reduce operational complexity and improve network reliability and performance.

Last week, ³Ô¹ÏºÚÁÏ announced the expansion of its multi-generational 1.6T ZR/ZR+ and coherent DSP technology portfolio, underscoring the company¡¯s commitment to continually deliver the latest scale-up, scale-out and scale-across technologies to drive AI innovation.

Availability

³Ô¹ÏºÚÁÏ Ara X, Ara T, Petra and Aquila M DSPs are sampling to customers beginning in Q1 2026.

³Ô¹ÏºÚÁÏ will showcase its end-to-end connectivity portfolio at OFC 2026, March 15¨C19, at the Los Angeles Convention Center in Los Angeles, California. Visit the ³Ô¹ÏºÚÁÏ booth #1600 to learn how the company is driving the next generation of data center and AI infrastructure.

About ³Ô¹ÏºÚÁÏ

To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies for over 30 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing the way tomorrow¡¯s enterprise, cloud and carrier architectures transform¡ªfor the better.

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This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the ¡°Risk Factors¡± section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.

Media Contact:
George Millington
pr@marvell.com

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