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Posts Tagged 'award'

• July 14, 2026

  

  

  

  Uplifting Young Talent in the Semiconductor Industry

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  The semiconductor industry is an exciting place to build a career, especially with the exponential growth and demand for hardware innovation in the age of AI¡ªthe global semi market is approaching the $1 trillion mark, with 2027¡¯s total market forecast at $831.5 million.¹ For young engineers and talent, it provides an opportunity to solve complex problems and work on cutting-edge technology.

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• July 09, 2026

  

  

  

  Honoring Workplace Excellence: Best Companies Awards

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  ³Ô¹ÏºÚÁÏ was named to both and for 2026.

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• July 01, 2026

  

  

  

  Innovating Sustainably: Recognized Among the World¡¯s Most Sustainable Companies in 2026

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  TIME Magazine has recognized ³Ô¹ÏºÚÁÏ as one of the for the third year in a row. ³Ô¹ÏºÚÁÏ is honored to have been represented since the origin of this ranking, as the company has demonstrated consistent, measurable progress across a number of sustainability initiatives.

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• May 12, 2026

  

  

  

  Dr. Hamid Azimi Wins ISIG Lifetime Hall of Fame Award

  By Michael Kanellos, Director of Content Marketing, and Vienna Alexander, Marketing Content Professional

  

  At the in Silicon Valley, ³Ô¹ÏºÚÁÏ Senior Vice President of Foundry and Advanced Packaging Dr. Hamid Azimi received the 2026 award. This recognition celebrates leaders whose lifetime contributions have had a lasting impact, significantly advancing the semiconductor industry.

  Over a career spanning more than 30 years, Dr. Azimi has led teams that have achieved numerous industry-leading advances in packaging. He was part of the team that developed the first flip-chip packaging with Ajinomoto Build-Up Film (ABF) substrates, a combination that enables engineers to design packaging containing far more and much smaller interconnects to improve signal integrity and power flow. Hamid and his team also enabled EMIB (Embedded Multi-Chip Interconnect Bridge) technology from scratch to high volume manufacturing. EMIB is the first 2.5 interposer-less panel level technology that enables ultra-large packages for AI data center products; he also has been a pioneer in glass substrates, a potential technology that could further enhance the capability of future generations of devices. Originally from a small village that ¡°probably doesn¡¯t even register on Google Maps,¡± Dr. Azimi holds over 40 patents. He earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

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• April 16, 2026

  

  

  

  HCDS Best Paper Award Winner: Bridging the Memory Hierarchy Gap with Photonic Fabric? Technology

  By Vienna Alexander, Marketing Content Professional, ³Ô¹ÏºÚÁÏ

  

  At the , co-located with Architectural Support for Programming Languages and Operating Systems (ASPLOS), Senior Staff Engineer Jing Ding won Best Paper for her research on the ³Ô¹ÏºÚÁÏ? Photonic Fabric? Technology Platform.

  There is a critical mismatch between the capacity and bandwidth available across memory tiers and the demands of large-scale LLM inference, revealed through characterizing KV cache retrieval efficiency. In fact, across LLaMA3-8B to 405B on NVIDIA A100/H200 systems, retrieving KV cache from host memory achieves up to 100x speedup over GPU re-computation for contexts up to 4M tokens, but host DRAM capacity cannot accommodate the KV demands of long-context, multi-tenant and multi-turn workloads.

  While CXL-enabled memory pooling could be applied in this capacity, it faces fundamental electrical interconnect limitations, namely rack-scale distance constraints, switch contention under multi-host workloads, and power-thermal scaling challenges. By leveraging the Photonic Fabric??optical interconnect technology platform to break reach limitations, along with CXL as a host communication protocol, ³Ô¹ÏºÚÁÏ enables a unique pod-scale memory sharing appliance that can enable up to 16 servers across multiple racks to dynamically share up to 32 TB of memory capacity.

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Recent Posts

• Uplifting Young Talent in the Semiconductor Industry
• Honoring Workplace Excellence: Best Companies Awards
• Scaling AI Networks with Intelligent Ethernet: Validating Packet Trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET) on ³Ô¹ÏºÚÁÏ Teralynx
• Innovating Sustainably: Recognized Among the World¡¯s Most Sustainable Companies in 2026
• Structera X and A CXL Compression: Making Every Gigabyte Count