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Dr. Hamid Azimi

Senior Vice President, Advanced Packaging and Foundry

Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at ³Ô¹ÏºÚÁÏ. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support ³Ô¹ÏºÚÁÏ¡¯s data infrastructure products.

Prior to joining ³Ô¹ÏºÚÁÏ, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.

A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.

Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.