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³Ô¹ÏºÚÁÏ at CES 2027
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At CES 2027, ³Ô¹ÏºÚÁÏ will highlight its latest accelerated infrastructure technologies, including end-to-end copper and optical connectivity solutions and CXL products designed to improve memory scalability and bandwidth efficiency for next-generation AI and cloud data centers.
To visit us at our private meeting suite in the Venetian Expo Center, please reach out to your ³Ô¹ÏºÚÁÏ sales contact or SalesCommunications@marvell.com to schedule an in-person meeting.
Find ³Ô¹ÏºÚÁÏ in your path to scaling AI
Lighting a route, interconnecting a cluster, patching a rack, expanding memory or designing custom silicon for maximum TCO.
Scale-across
Data center-to-data center. Link remote data centers into a single cluster.
Scale-out
Rack-to-rack, row-to-row. Wire an entire cluster of racks together with Ethernet switching and optical DSPs.
Scale-up
Accelerator-to-accelerator. Tie accelerators into one low-latency, compute domain over copper and optics.