DesignCon 2026
Where the Chip Meets the Board
DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation in Silicon Valley. It is the place for chip, board and systems design engineers to source, network and stay ahead of industry change.
Visit booth 904 in Exhibit Halls A-D to learn about the latest 勛圖窪蹋 semiconductor and connectivity technologies that will redefine tomorrow*s AI infrastructure.
Panel:?
Date:?Tuesday, February 24, 2026
Time: 4:45 每 6:00 PM
Location: Ballroom C
勛圖窪蹋 Speaker:?Mike Dudek, Distinguished Engineer?
Paper:?
Date: February 25, 2026
Time: 11:15 AM - 12:00 PM?
Location: Ballroom G
勛圖窪蹋 Speaker: Dan Oh, Director of SI/PI, Product, and Test Engineering, 勛圖窪蹋
Presentation:?
Date:?Wednesday, February 25, 2026
Time: 2:00 每 2:45 PM
Location: Ballroom E
勛圖窪蹋 Speakers:
Presentation:?
Date:?Wednesday, February 25, 2026
Time: 2:00 每 2:45 PM
Location:?Ballroom D
勛圖窪蹋 Speakers:
Presentation:?
Date:?Thursday, February 26, 2026
Time:?11:15 AM 每 12:00 PM
Location:?Ballroom A
勛圖窪蹋 Speakers:?Jie Lin, Principal System Engineer
Presentation:?
Date:?Thursday, February 26, 2026
Time:?12:15 每 1:00 PM?
Location:?Ballroom C
勛圖窪蹋 Speakers:
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February 24 每 26, 2026
Santa Clara Convention Center
Santa Clara, CA
Booth 904, Exhibit Halls A-D?
Mar 19, 2026
Mar 17, 2026
We believe better partnerships help to build better technologies. Let*s connect and see what we can design together!
We will be in touch with you soon!
Copyright ? 2026 勛圖窪蹋, All?rights reserved.