³Ô¹ÏºÚÁÏ

³Ô¹ÏºÚÁÏ at IMAPS Symposium 2026

The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society (IMAPS). IMAPS Symposium 2026 will focus on ¡°Intelligent Packaging for the AI Era: Heterogeneous Integration and Photonics¡± and will offer one of the most robust programs for microelectronics and advanced packaging technical content.

The event will begin with professional development courses, followed by three days of technical sessions on advanced package structures, advanced interconnect technology, design and modeling, AI enablement and more.

³Ô¹ÏºÚÁÏ Presentations

Date: Thursday, October 1, 2026
Time: 8:15 ¨C 9:00 AM
³Ô¹ÏºÚÁÏ Presenter: Ankur Aggarwal, Vice President, Advanced Packaging & Supply Chain, Photonic Fabric Engineering