Semicon Japan
December 13-15, 2023
- ³Ô¹ÏºÚÁÏ
- COMPANY
- SUPPORT
- ³Ô¹ÏºÚÁÏ
- BY TYPE
- BY MARKET
- COMPANY
Our Company
Media
Contact
- SUPPORT
BY TYPE
Compute
Networking
BY MARKET
Our Company
Contact
³Ô¹ÏºÚÁÏ Presents at Semicon Japan, Advanced Packaging and Chiplet Summit
³Ô¹ÏºÚÁÏ Presentation
Title:?Semiconductor Innovations Driving the Next-Generation of High-Speed Data Infrastructure
Date:?December 15, 2023?
Time :?12:35 pm
³Ô¹ÏºÚÁÏ Presenter: Sandeep Bharathi, Chief Development Officer
Sandeep Bharathi will present the latest advances in process node geometries as well as innovations in chiplet design and semiconductor packaging techniques that allow ³Ô¹ÏºÚÁÏ¡¯s customers to drive the next generation of high-speed data infrastructure for the data center, telecommunications, enterprise and automotive markets.
Where to Find US
December 13-15, 2023
Tokyo, Japan
Register
Recent News
May 27, 2026
May 04, 2026
Worldwide
Copyright ? 2026 ³Ô¹ÏºÚÁÏ, All?rights reserved.
- Terms of Use
- Privacy Policy
- Contact