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³Ô¹ÏºÚÁÏ Announces Successful Interoperability of Structera CXL Portfolio with AMD EPYC CPU and 5^th Gen Intel Xeon Scalable Platforms

Enabling Cloud Data Center Operators to Overcome Memory Performance and Scaling Challenges in General-purpose Servers

SANTA CLARA, Calif. ¡ª April 23, 2025 ¡ª?. (NASDAQ: MRVL),?), a leader in data infrastructure semiconductor solutions, today announced the successful interoperability of the ³Ô¹ÏºÚÁÏ^??Structera??portfolio of Compute Express Link??(CXL?)with AMD EPYC? CPUs and 5^th Gen Intel Xeon platforms.?This achievement underscores the commitment of ³Ô¹ÏºÚÁÏ to advancing an open and interoperable CXL ecosystem, addressing the growing demands for memory bandwidth and capacity in next-generation cloud data centers.?

³Ô¹ÏºÚÁÏ collaborated with AMD and Intel to extensively test Structera CXL products with AMD EPYC and 5^th Gen Intel Xeon Scalable platforms across various configurations, workloads, and operating conditions. The results demonstrated seamless interoperability, delivering stability, scalability, and high-performance memory expansion that cloud data center providers need for mass deployment.

This interoperability gives customers the flexibility to choose from a variety of CPU architectures, enabling deployment of CXL solutions across diverse hardware configurations. By leveraging the strengths of each platform for specific workloads and applications, customers can maximize their investment while maintaining seamless integration and consistent performance.

¡°CXL 2.0 represents the next generation of scalable infrastructure. The collaboration between AMD, Intel and ³Ô¹ÏºÚÁÏ will help enable the growth of an ecosystem for driving the benefits of CXL for customers everywhere,¡± said Will Chu, senior vice president and general manager, Custom Cloud Solutions at ³Ô¹ÏºÚÁÏ. ¡°This successful interoperability showcases our ability to deliver innovative, high-performance solutions that redefine the efficiency, sustainability, and performance of cloud technology.¡±

¡°We are committed to advancing high-performance, scalable, and energy-efficient solutions to power next-generation data centers,¡± said Raghu Nambiar, corporate vice president, Data Center Ecosystems and Solutions, AMD. ¡°Our deep technology partnership with ³Ô¹ÏºÚÁÏ combines the robust capabilities of AMD EPYC processors with ³Ô¹ÏºÚÁÏ¡¯s CXL portfolio to help our customers unlock enhanced memory efficiency, greater flexibility, and reduced total cost of ownership¡ªdriving tangible benefits for business-critical workloads.¡±

¡°Our collaboration and ongoing enablement activities with ³Ô¹ÏºÚÁÏ demonstrate our commitment to the CXL 2.0 standard, helping to ensure memory efficiency and seamless deployment across cloud-scale infrastructures,¡± stated Richelle Ahlvers, director, Ecosystem Enabling and Technology Initiatives, Intel.

Enabling Scalable and Efficient Data Center Architectures

The Structera product family, built on CXL 2.0, enables cloud service providers and server OEMs to dramatically increase the memory capacity and bandwidth of servers or add additional computing cores to improve the performance and capabilities of cloud servers efficiently and economically. Structera can also add computing cores for offloading memory-intensive applications such as artificial intelligence, machine learning, in-memory databases and high-performance computing. Key products within the Structera portfolio include:?

• Structera A: Near-memory accelerators featuring server-class Arm^? Neoverse^? V2 cores, DDR5 support, and up to 1.6 Tbps of memory bandwidth, optimized for high-bandwidth workloads such as deep learning recommendation models (DLRM).?
• Structera X: Memory expansion controllers supporting DDR4 and DDR5 DIMMs, enabling the deployment of terabytes of memory capacity while optimizing both cost efficiency and power consumption.?

The integration of CXL 2.0 technology enables cache coherency and memory pooling across devices, optimizing resource utilization, reducing the need for additional servers, and promoting sustainable data center architectures.?

About ³Ô¹ÏºÚÁÏ
To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies for over 25 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing the way tomorrow¡¯s enterprise, cloud, automotive, and carrier architectures transform¡ªfor the better.


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³Ô¹ÏºÚÁÏ and the M logo are trademarks of ³Ô¹ÏºÚÁÏ or its affiliates. Please visit www.marvell.com for a complete list of ³Ô¹ÏºÚÁÏ trademarks. Other names and brands may be claimed as the property of others.

AMD, the AMD Arrow logo, EPYC, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.?

This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the ¡°Risk Factors¡± section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.

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