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³Ô¹ÏºÚÁÏ Joins Universal Chiplet Interconnect Express Consortium

Brings Established Expertise in Multi-Chiplet, Cloud-Optimized Silicon Design to Open Industry Standards Collaboration

SANTA CLARA, Calif.¡ª June 8, 2022¡ª ³Ô¹ÏºÚÁÏ (NASDAQ: MRVL) today announced that the company has joined the Universal Chiplet Interconnect Express (UCIe) Consortium as part of its ongoing development of open chiplet interconnect standards. ³Ô¹ÏºÚÁÏ¡¯s contributions to the UCIe standard will leverage the company¡¯s advanced chiplet interconnect and packaging experience to help further the consortium¡¯s objective of developing open standards that create a more robust ecosystem for inter-operable chiplets.

³Ô¹ÏºÚÁÏ¡¯s UCIe participation is complementary to the company¡¯s existing work in the Open Compute Project (OCP) and Optical Internetworking Forum (OIF) which is aimed at the development of open standards-based solutions for connecting single or multi-node 5nm and 3nm chiplets. Through these experiences, ³Ô¹ÏºÚÁÏ brings advanced domain knowledge and a unique perspective that will help align and optimize global chiplet interconnect standards for a range of leading-edge applications with differing requirements such as CXL, Ethernet and custom low-latency connectivity while fostering chiplet interoperability.

¡°³Ô¹ÏºÚÁÏ has been an industry pioneer in chiplet connectivity and continues to push the envelope of performance optimization for a wide range of multi-chiplet applications in advanced packaging architectures,¡± said Noam Mizrahi, Chief Technology Officer and Senior Fellow at ³Ô¹ÏºÚÁÏ. ¡°We see the great value in aligning interconnect standards across the industry and look forward to contributing towards that goal as a member of the UCIe consortium.¡±

¡°UCIe represents the culmination of years of learning and implementation experience with on-package interconnects at a time that is right for industry standardization,¡± said Dr. Debendra Das Sharma, Intel Senior Fellow. ¡°We are excited that ³Ô¹ÏºÚÁÏ has joined the consortium and is working to develop cloud-optimized multi-die solutions that are compatible with UCIe.¡±

¡°The increasing complexity of data center SoCs elevates the importance of high-speed interconnect for massively complex multi-die designs with advanced packaging, where ³Ô¹ÏºÚÁÏ brings extensive expertise to UCIe,¡± said Linley Gwennap, Principal Analyst,?TechInsights. ¡°Diverging and demanding requirements of emerging applications, including CXL and a range of low-latency use cases, underscores the importance of having both interoperable and application-optimized open chiplet interconnect standards.¡±

For more information on ³Ô¹ÏºÚÁÏ¡¯s ASIC and SoC design capabilities, visit us at /products/custom-asic.html

About ³Ô¹ÏºÚÁÏ

To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies over 25 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing the way tomorrow¡¯s enterprise, cloud, automotive, and carrier architectures transform¡ªfor the better.

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