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³Ô¹ÏºÚÁÏ to Showcase Cloud-Optimized Electro-Optics and Networking at OFC 2023

SAN DIEGO, Calif. ¨C March 6, 2023 ¨C ³Ô¹ÏºÚÁÏ Technology, Inc.?(NASDAQ: MRVL),??a leader in data infrastructure semiconductor solutions, today announced the details of its participation at the 2023 Optical Networking and Communication (OFC) Conference. OFC is the premier event for optical communications and networking professionals.

When:

OFC 2023 is being held March 5-9, 2023.

Where:

³Ô¹ÏºÚÁÏ will be in booth #4326, located in the San Diego Convention Center in San Diego.

Demonstrations in ³Ô¹ÏºÚÁÏ Booth:

²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ cloud-optimized electro-optics and networking solutions are driving high-speed connectivity and power efficiency inside the data center, between data centers and in carrier networks. Visit ²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ booth to see the following demonstrations and product displays:

• Nova?, the industry¡¯s first 1.6T PAM4 electro-optics platform for AI/ML and cloud data center networks, is powered by a 200 Gbps/lambda optical DSP, doubling the optical bandwidth of current solutions.
  
• Live edge-to-cloud network demonstration featuring ³Ô¹ÏºÚÁÏ^? Teralynx^? and Prestera^? switch silicon, COLORZ^? II ZR/ZR+ pluggable modules, Alaska^? Ethernet PHYs, and Porrima? and Alcor? PAM4 DSPs.
  
• Active Electrical Cables (AECs) powered by the ³Ô¹ÏºÚÁÏ^? Alaska^? A 800G PAM4 DSP family.
• A wide range of pluggable optical modules that include ²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ COLORZ II ZR/ZR+ modules for data center interconnect; coherent modules from OEMs across the ecosystem powered by ²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ Canopus? and Deneb? DSPs; and OEM optical interconnect modules powered by ²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ PAM4 DSPs.

³Ô¹ÏºÚÁÏ Technology at OFC:

²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ Spica? Gen2 800G PAM4 DSPs are featured in a variety of optical modules at the following booths:

• Accelink: Booth #4314
• Arista: Booth #5401
• InnoLight: Booth #4115
• Linktel: Booth #2531
• Source Photonics: Booth #3029

³Ô¹ÏºÚÁÏ will participate in two interoperability demonstrations at OFC with ²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ 400ZR technology at the Optical Internetworking Forum (OIF) Booth #5101 and the ³Ô¹ÏºÚÁÏ Alaska C X9340P 5nm 1.6T PHY with MACsec encryption at the Ethernet Alliance Booth #5417.

³Ô¹ÏºÚÁÏ Presentations and Panels:

Workshop:?
Date: Sunday, March 5, 1:00 p.m.
Location: Room 7AB
Presenter: Kishore Kota, Associate Vice President Engineering, Coherent DSP

Workshop:?Date: Sunday, March 5, 1:00 p.m.
Location: Room 8
Presenter: Dr. Radha Nagarajan, Senior Vice President and Chief Technology Officer, Optical and Copper Connectivity Group

Workshop:?
Date: Sunday, March 5, 2023, 4:00 p.m.
Location: Room 8
Presenter: Arash Farhoodfar, Vice President of Engineering, Optical and Copper Connectivity?

Panel:?
Date: Monday, March 6, 4:30 p.m.
Location: Room 6C
Presenter:?Lenin Patra, Vice President and Chief Technology Officer, PHY

Show Floor Program:?
Tuesday, March 7, 10:45 a.m.
Location: Theater II
Presenter: Dr. Loi Nguyen, Executive Vice President, Optical and Copper Connectivity Group

Market Watch Panel:?
Date: Tuesday, March 7, 12:15 p.m.
Location: Theater I
Presenter: Xi Wang, Vice President of Product Marketing, Optical DSP

Market Watch Panel:?
Date: Tuesday, March 7, 2:00 p.m.
Location: Theater I?
Presenter:?Dr. Radha Nagarajan, Senior Vice President and Chief Technology Officer, Optical and Copper Connectivity Group

Poster:?Date: Wednesday, March 8, 10:30 a.m. ?
Location: Exhibit Hall?
Presenter: Arik Zafrany, Senior Principal Engineer, Optical PHY

Show Floor Program:?Date: Wednesday, March 8, 11:45 a.m.
Location: Theater II
Presenter: Samuel Liu, Senior Director, Product Line Management, Coherent DSP

Show Floor Program:?
Date: Wednesday, March 8, 1:00 p.m.
Location: Theater II
Presenter: Josef Berger, Associate Vice President Marketing, Optical and Copper Connectivity

Invited Talk:??
Date: Thursday, March 9, 8:00 a.m.
Location: Room 6D?
Presenter: Hai Xu, Distinguished Engineer?, Coherent DSP

News Highlights:

³Ô¹ÏºÚÁÏ Launches Industry¡¯s First 1.6 Tbps PAM4 Electro-Optics Platform for Cloud AI/ML and Data Center Networks: ³Ô¹ÏºÚÁÏ announced its Nova 1.6 Tbps PAM4 electro-optics platform, the industry¡¯s first of its kind, now sampling to customers.

³Ô¹ÏºÚÁÏ Announces Cloud-Optimized 51.2 Tbps Networking Platform for AI/ML and Data Center Networks: ³Ô¹ÏºÚÁÏ announced a new platform, which quadruples the bandwidth of widely deployed 12.8 Tbps networking solutions, comprised of the ultra-low latency ³Ô¹ÏºÚÁÏ Teralynx 10 51.2 Tbps switch chip and the Nova PAM4 1.6 Tbps electro-optics platform.

: Learn more about how ²Ñ²¹°ù±¹±ð±ô±ô¡¯²õ Teralynx 10 51.2 Tbps switch chip is addressing the operator bandwidth explosion while meeting stringent power- and cost-per-bit requirements.

About ³Ô¹ÏºÚÁÏ

To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform¡ªfor the better.?

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For further information, contact:
Kim Markle, Influencer Relations
pr@marvell.com

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