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³Ô¹ÏºÚÁÏ to Showcase Cloud-Optimized Optical Connectivity Solutions at ECOC 2022

SANTA CLARA, Calif. ¨C September 16, 2022 ¨C?³Ô¹ÏºÚÁÏ (NASDAQ: MRVL) today announced the details of its participation at the European Conference on Optical Communication (ECOC), Europe¡¯s largest optical communications event.?

When:

The ECOC Exhibition begins on Monday, September 19 and continues through Wednesday, September?21.

Where:

ECOC will take place at Messe Basel in Basel, Switzerland with ³Ô¹ÏºÚÁÏ in booth #219.

Demonstrations:

At its booth, ³Ô¹ÏºÚÁÏ will showcase its comprehensive networking solution portfolio, including cutting-edge PAM4 DSPs, coherent DSPs, TIAs, drivers, switches and PHYs that are driving high-speed connectivity both between and inside data centers and carrier networks.

• In collaboration with Smartoptics and LightRiver, ³Ô¹ÏºÚÁÏ will demonstrate the IPoDWDM capabilities of its COLORZ? II QSFP-DD 400G ZR+ optics for Metro DWDM applications. The live demo at ³Ô¹ÏºÚÁÏ¡¯s booth will highlight open, disaggregated multi-vendor interoperability of a 3-node ROADM ring, including the optical domain orchestration and control software layer.
• ³Ô¹ÏºÚÁÏ will demonstrate its industry-leading 5nm 112G Long Reach (LR) SerDes designed for demanding cloud-optimized applications.?
• ³Ô¹ÏºÚÁÏ will showcase its Spica? PAM4 DSP, the industry¡¯s first 800Gbps PAM4 DSP to support 800G optical modules in QSFP-DD800 and OSFP form factors for inside-the-data center optical interconnect and its AtlasOne? PAM4 DSP, the industry¡¯s first 50Gbps PAM4 DSP for 5G RAN fronthaul interconnect.
• Optical modules from across the ecosystem powered by ³Ô¹ÏºÚÁÏ technologies and silicon solutions will be on display.
• OIF members will showcase interoperability in four critical areas at this year¡¯s ECOC 2022. The work of OIF and its members in 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations will be demonstrated - live and static - at OIF¡¯s booth, #701. Additional information can be found

Presentation:

Title:
Date: Wednesday, September 21
Time: 10:45 a.m.
Location: Market Focus Theatre
Presenter: Xi Wang, Vice President of Optical DSP Business Unit, ³Ô¹ÏºÚÁÏ

About ³Ô¹ÏºÚÁÏ

To deliver the data infrastructure technology that connects the world, we¡¯re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world¡¯s leading technology companies for over 25 years, we move, store, process and secure the world¡¯s data with semiconductor solutions designed for our customers¡¯ current needs and future ambitions. Through a process of deep collaboration and transparency, we¡¯re ultimately changing?the way tomorrow¡¯s enterprise, cloud, automotive, and carrier architectures transform¡ªfor the better.

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