As AI systems grow in complexity and scale, the network becomes the backbone of the compute system. Large-scale clusters require massive XPU-to-XPU communication, demanding a new approach to connectivity. ³Ô¹ÏºÚÁÏ brings over a decade of silicon photonics and optical connectivity experience, delivering end-to-end solutions with the expertise and portfolio required to support the full data center connectivity stack.
³Ô¹ÏºÚÁÏ optical interconnects enable high-performance scaling beyond the rack. This enables XPUs to operate as a more efficient, unified system as scale-up domains expand. The native high performance Photonic Fabric? technology provides what ³Ô¹ÏºÚÁÏ believes will be the most flexible, high bandwidth density, low latency and power efficient optical I/O in the industry.
The Photonic Fabric technology platform, which?³Ô¹ÏºÚÁÏ gained through the acquisition of Celestial AI, is?purpose-built for the?emerging scale-up interconnect market.?With this acquisition, ³Ô¹ÏºÚÁÏ further strengthens its leadership across critical optical interconnect technologies required for next-generation AI and cloud architectures. The technology will enable more tightly integrated, high-bandwidth and power-efficient solutions for data center customers.
President and Chief Operating Officer Chris Koopmans outlines the impact of Celestial AI optical scale-up fabric and how it dovetails with existing ³Ô¹ÏºÚÁÏ scale out switches and interconnects.
The ³Ô¹ÏºÚÁÏ??Photonic Fabric? technology is a revolutionary optical interconnect platform for scale-up networks. It enables continued scaling in AI data center compute by delivering?very high?bandwidth with in-network high-performance, high-capacity memory. The Photonic Fabric platform is the only technology addressing the full stack of connectivity, switching, and packaging challenges. By?leveraging?photonics expertise, high-speed AMS Design, 2.5D packaging and software?combined with ³Ô¹ÏºÚÁÏ UAL and E-SUN?networking solutions, Photonic Fabric technology provides customers with solutions that help them design AI infrastructure for the next decade.
This diagram outlines the architecture of a scale-up network by comparing traditional networks to those using the Photonic Fabric chiplets integrated within the XPU, demonstrating how the ³Ô¹ÏºÚÁÏ solution significantly extends the scale from within the rack to many meters for a multi-rack application. The power savings are also compelling, with the new solution cutting power consumption by about 75%.
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