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Join ³Ô¹ÏºÚÁÏ at this Year¡¯s ECOC Exhibition!

The Networking Destination for the Optical Communications Industry

With the explosive growth in data centers around the globe, every major cloud platform is rapidly scaling to meet the insatiable need for more bandwidth. The future architecture of these cloud data centers will be more connected than ever ¨C with optics forming the interconnected fabric. With cloud-optimized silicon driving this data infrastructure, stop by ³Ô¹ÏºÚÁÏ¡¯s booth #219 to learn more on how ³Ô¹ÏºÚÁÏ¡¯s innovative architecture is leading this new era in cloud convergence.

³Ô¹ÏºÚÁÏ Presentations

Title:?
Date:??Sunday, September 18, 2022
Time:??2:00 p.m.?
Location:?Room: San Francisco
Presenter:? Kishore Kota, AVP Engineering, Coherent DSP Group

Topic:?Session 1: Give me Moore for less!
Posed Questions: What progress have we made in reducing power consumption for optical transceivers and ASICs? Will Moore¡¯s law save us? What¡¯s the limit? How can we optimize power through design? How much power remains in the optics? What can we save? Optimising power depending on traffic load? Game-changers?

Title:?
Date: Wednesday, September 21
Time: 10:45 a.m.
Location: Market Focus Theatre
Presenter: Xi Wang, Vice President of Optical DSP Business Unit

Abstract: Optical connectivity is the foundation of today¡¯s internet infrastructure and has enabled the emergence of hyperscale data centers and a new era of wireless communication. The insatiable demand for cloud-based services is continuously driving the relentless need for data center hardware to have higher bandwidth capacity, with lower power consumption and smaller footprints. Just as data centers begin their transition to 400G and 800G, the bar is rising towards the next evolution of 1.6T and 3.2T, with the same demands for high performance and low power with minimal financial impact. This presentation will discuss the underlying technologies needed to enable 1.6T and 3.2T, and how technological advancements in both electronics and optics will enable a higher level of integration that will have a lasting impact for future generations of optical connectivity.

Demonstrations:
At its booth, ³Ô¹ÏºÚÁÏ will showcase its comprehensive networking solution portfolio, including cutting-edge PAM4 DSPs, coherent DSPs, TIAs, drivers, switches and PHYs that are driving high-speed connectivity both between and inside data centers and carrier networks.

• In collaboration with Smartoptics and LightRiver, ³Ô¹ÏºÚÁÏ will demonstrate the IPoDWDM capabilities of its COLORZ^? II QSFP-DD 400G ZR+ optics for Metro DWDM applications. The live demo at ³Ô¹ÏºÚÁÏ¡¯s booth will highlight open, disaggregated multi-vendor interoperability of a 3-node ROADM ring, including the optical domain orchestration and control software layer.
• ³Ô¹ÏºÚÁÏ will demonstrate its industry-leading 5nm 112G Long Reach (LR) SerDes designed for demanding cloud-optimized applications.
• ³Ô¹ÏºÚÁÏ will showcase its Spica? PAM4 DSP, the industry¡¯s first 800Gbps PAM4 DSP to support 800G optical modules in QSFP-DD800 and OSFP form factors for inside-the-data center optical interconnect and its AtlasOne? PAM4 DSP, the industry¡¯s first 50Gbps PAM4 DSP for 5G RAN fronthaul interconnect.
• Optical modules from across the ecosystem powered by ³Ô¹ÏºÚÁÏ technologies and silicon solutions will be on display.
• OIF members will showcase interoperability in four critical areas at this year¡¯s ECOC 2022. The work of OIF and its members in 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations will be demonstrated - live and static - at OIF¡¯s booth, #701. Additional information can be found .